Aluminum nitride ceramic packaging substrate

Base material type: aluminum nitride ceramic Thermal conductivity: 170W/(m · K) Base material thickness: 0.5mm Conductive layer: copper, nickel, gold Metal copper thickness: 0.2mm double-sided bottom copper Line width an

99% alumina ceramic circuit board

Substrate type: 99% alumina ceramic circuit board Base material thickness: 1.0mm Conductive layer: copper, nickel, palladium, gold Metal layer thickness: 300 μ M Surface treatment: nickel palladium Metal single/double si

99.6% alumina ceramic circuit board

Base material type: 99.6% alumina ceramic Base material thickness: 2.0mm Conductive layer: copper, nickel, palladium, gold Metal layer thickness: 70um+200 μ M Surface treatment: nickel palladium Metal single/double sided

96% alumina ceramic circuit board

Base material type: 96% alumina ceramic Base material thickness: 0.5mm Conductive layer: copper, nickel, gold Metal layer thickness: 65 μ M Surface treatment: nickel gold Metal single/double sided: double sided Th

Ceramic cutting

The detailed product introduction is as follows 1. Materials ① . 96% alumina ceramic ②. 99% aluminum nitride ceramic. Sapphire ④. High borosilicate glass

Ceramic metallization

Base material type: 96% Al2O3; 96% AlN