Aluminum oxide ceramic cooling sheet copper clad plate

Base material type: aluminum nitride ceramic Base material thickness: 0.38mm Metal layer thickness: 350 μ M Surface treatment: nickel and palladium precipitation Metal single/double sided: double sided Through hole: None

Aluminum nitride ceramic PCB

Base material type: aluminum nitride ceramic Base material thickness: 0.38mm Metal layer thickness: 350 μ M Surface treatment: nickel and palladium precipitation Metal single/double sided: double sided Through hole: None

Aluminum nitride ceramic cooling sheet copper clad plate

Base material type: aluminum nitride ceramic Base material thickness: 0.15mm Metal layer thickness: 18 μ M Surface treatment: nickel and palladium precipitation Cutting method: water jet cutting, with a blue film on the back

Aluminum nitride ceramic heat sink

Base material type: aluminum nitride ceramic substrate Thermal conductivity: 230W/(m · K) Base material thickness: 0.38mm Metal copper thickness: 18 μ M Conductive layer: copper, nickel, palladium, gold Line width and di

Aluminum nitride ceramic packaging substrate

Base material type: aluminum nitride ceramic Thermal conductivity: 170W/(m · K) Base material thickness: 0.5mm Conductive layer: copper, nickel, gold Metal copper thickness: 0.2mm double-sided bottom copper Line width an

Semiconductor refrigeration sheets - Aluminum oxide copper clad sheets - Double sided - Deposited nickel palladium

Substrate type: alumina Number of layers: double-sided Thickness: 0.25mm Size: 2.2X3MM (single) Plate thickness copper: 18um Copper thickness inside the hole:/ Line width and distance: 0.2/0.1mm Minimum aperture:/ Surface treatment