Aluminum nitride ceramic circuit board enclosure dam

Base material type: aluminum nitride ceramic Base material thickness: 0.5mm Conductive layer: copper, nickel, palladium, gold Metal layer thickness: 980 μ M Surface treatment: nickel and palladium precipitation Metal single/double sided: do

Aluminum nitride ceramic PCB dam panel

Base material type: alumina ceramic Base material thickness: 0.5mm Conductive layer: copper, nickel, palladium, gold Metal layer thickness: 890 μ M Surface treatment: nickel and palladium precipitation Metal single/double sided: double side

Aluminum nitride ceramic dam plate packaging substrate

Substrate type: aluminum nitride ceramic circuit board Base material thickness: 0.5mm Conductive layer: copper, nickel, palladium, gold Metal layer thickness: 980 μ M Surface treatment: nickel and palladium precipitation

99.6% alumina ceramic circuit board

Base material type: 99.6% alumina ceramic Base material thickness: 2.0mm Conductive layer: copper, nickel, palladium, gold Metal layer thickness: 70um+200 μ M Surface treatment: nickel palladium Metal single/double sided

Integrated dam design with ceramic packaging substrate

In LED ceramic packaging, Sliton's 3D ceramic substrate serves as the carrier substrate for the chip, playing a role in mechanical support protection, electrical interconnection (insulation), thermal conduction and heat dissipation, and auxiliary light ou

Aluminum nitride ceramic support - double-sided dam - sunk nickel palladium

Substrate type: aluminum nitride Number of floors: double-sided+dam enclosure Thickness: 0.5mm Size: 54.5 * 109.2 π m Plate copper thickness: double-sided bottom copper 0.07mmt front dam 0.4mmt front step 0.2mm Copper thickness inside the h