Aluminum nitride ceramic circuit board enclosure dam

Base material type: aluminum nitride ceramic Base material thickness: 0.5mm Conductive layer: copper, nickel, palladium, gold Metal layer thickness: 980 μ M Surface treatment: nickel and palladium precipitation Metal single/double sided: do

Matrix LED ceramic bracket

Special type: large size Base material thickness: 2.0mm Conductive layer: copper nickel palladium Metal layer thickness: 100 μ M Surface treatment: nickel palladium Metal single/double sided: double sided Resistan

99% alumina ceramic circuit board

Substrate type: 99% alumina ceramic circuit board Base material thickness: 1.0mm Conductive layer: copper, nickel, palladium, gold Metal layer thickness: 300 μ M Surface treatment: nickel palladium Metal single/double si

Aluminum nitride ceramic support - double-sided dam - sunk nickel palladium

Substrate type: aluminum nitride Number of floors: double-sided+dam enclosure Thickness: 0.5mm Size: 54.5 * 109.2 π m Plate copper thickness: double-sided bottom copper 0.07mmt front dam 0.4mmt front step 0.2mm Copper thickness inside the h

Metallization of aluminum nitride ceramic structure - double-sided+dam - nickel palladium precipitation

Substrate type: aluminum nitride Number of floors: double-sided+dam enclosure Thickness: 0.38mm Size: 3X3MM (single) Plate copper thickness: double-sided bottom copper 0.07mmt, front dam 0.5mt, front step 0.2 π m Copper thickness inside the

Aluminum oxide surface coated with copper

Aluminum oxide surface coated with copper