Aluminum nitride ceramic circuit board

Ceramic substrate: aluminum nitride ceramic heat sink Base material thickness: 0.38mm Conductive layer: copper nickel palladium Metal layer thickness: 65 μ M Surface treatment: nickel palladium Metal single/double sided:

Alumina side metallized ceramic circuit board

Special type: side metallization Base material thickness: 0.38mm Conductive layer: copper nickel palladium Metal layer thickness: 30um Surface treatment: deposited nickel gold Metal single/double sided: double sided

Sapphire ceramic circuit board

Substrate type: sapphire Base material thickness: 0.38mm Conductive layer: copper, nickel, gold Metal layer thickness: 18 μ M Surface treatment: deposited nickel gold Surface roughness of substrate: 0.02-0.08um Th

Silicon carbide ceramic substrate

Base material type: silicon carbide ceramic Base material thickness: 0.5mm Conductive layer: copper, nickel, gold Metal copper thickness: 65 μ M Line width: 0.3mm Through hole: None Surface treatment: deposited ni

Aluminum nitride ceramic packaging substrate

Base material type: aluminum nitride ceramic Thermal conductivity: 170W/(m · K) Base material thickness: 0.5mm Conductive layer: copper, nickel, gold Metal copper thickness: 0.2mm double-sided bottom copper Line width an

96% alumina ceramic circuit board

Base material type: 96% alumina ceramic Base material thickness: 0.5mm Conductive layer: copper, nickel, gold Metal layer thickness: 65 μ M Surface treatment: nickel gold Metal single/double sided: double sided Th