Aluminum oxide ceramic spiral structural components

Base material type: alumina ceramic Base material thickness: 1cm Base material diameter: 3cm Conductive layer: copper, silver Metal layer depth: 7mm Width: 0.25mm Surface treatment: sinking silver

Thick film resistance alumina ceramic circuit board carbon oil

Base material type: alumina ceramic Base material thickness: 0.5mm Conductive layer: copper, silver Metal layer thickness: 100 μ M Surface treatment: sinking silver Metal single/double sided: double sided Through

Silicon carbide ceramic packaging substrate

Base material type: silicon carbide ceramic Base material thickness: 0.38mm Conductive layer: copper, silver Metal copper thickness: 5 μ M Line width and distance: 0.12/0.5mm Through hole: filling hole Surface tre

Piezoelectric ceramic circuit board

Substrate type: piezoelectric ceramic Base material thickness: 1.0mm Conductive layer: copper, silver Metal copper thickness: 100-300 μ M Line width and distance: 0.12/0.5mm Through hole: no hole Surface treatment

Aluminum nitride ceramic circuit board

Base material type: aluminum nitride ceramic Thermal conductivity: 200W/(m · K) Base material thickness: 1.0mm Metal copper thickness: 30 μ M Conductive layer: copper, silver Line spacing: 4.0mm Through hole: None

96% alumina ceramic PCB - small spacing - electroplating hole filling - silver precipitation

Substrate type: 96% alumina Number of layers: double-sided Thickness: 0.5mm Size: 54.5 * 109.2mm Board copper thickness: 0.07mm Copper thickness inside the hole: electroplated hole filling Line width and distance: --/0.12mm Minimum ap