Aluminum nitride ceramic dam plate packaging substrate

Substrate type: aluminum nitride ceramic circuit board Base material thickness: 0.5mm Conductive layer: copper, nickel, palladium, gold Metal layer thickness: 980 μ M Surface treatment: nickel and palladium precipitation

Aluminum oxide ceramic cooling sheet copper clad plate

Base material type: aluminum nitride ceramic Base material thickness: 0.38mm Metal layer thickness: 350 μ M Surface treatment: nickel and palladium precipitation Metal single/double sided: double sided Through hole: None

Aluminum nitride ceramic PCB

Base material type: aluminum nitride ceramic Base material thickness: 0.38mm Metal layer thickness: 350 μ M Surface treatment: nickel and palladium precipitation Metal single/double sided: double sided Through hole: None

Aluminum nitride ceramic packaging substrate

Base material type: aluminum nitride ceramic Thermal conductivity: 170W/(m · K) Base material thickness: 0.5mm Conductive layer: copper, nickel, gold Metal copper thickness: 0.2mm double-sided bottom copper Line width an

99% alumina ceramic circuit board

Substrate type: 99% alumina ceramic circuit board Base material thickness: 1.0mm Conductive layer: copper, nickel, palladium, gold Metal layer thickness: 300 μ M Surface treatment: nickel palladium Metal single/double si

Alumina ceramic PCB, thickness 0.635mm

Alumina ceramic PCB, thickness 0.635mm, metal layer copper thickness 800um