Substrate type: piezoelectric ceramic

Base material thickness: 1.0mm

Conductive layer: copper, silver

Metal copper thickness: 100-300 μ M

Line width and distance: 0.12/0.5mm

Through hole: no hole

Surface treatment: sinking silver

Product Features

Product FEATUR

1. Warpage ≤ 0.2%

2. Surface roughness: 1.6-6.4

3. Thermal conductivity: 2.5-3.5W/(m · K)

4. Breakdown resistance voltage: 24-30KV/mm

5. Bending strength: 1200MP