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Process Introduction and Application Fields of DPC Ceramic Copper Clad Substrate
Release time:2023-05-24 09:44:03  Author:富力天晟  Reading volume:150

Direct Plating Copper (DPC) process is a process used to prepare high-density electronic packaging materials. This process is the main method for metal film deposition in microelectronics 

manufacturing, mainly using surface deposition processes such as evaporation and magnetron sputtering to metallize the substrate surface. Firstly, titanium is sputtered under vacuum conditions, 

followed by copper particles, and finally, electroplating is used to thicken the circuit. Then, the circuit is made using ordinary PCB technology, and finally, the thickness of the circuit is increased 

through electroplating/chemical plating deposition.

 

The specific steps and parameters in the process may vary depending on the manufacturer and specific product, and need to be adjusted and optimized



The copper clad ceramic substrate (DPC) process has the following advantages:

 

Excellent thermal conductivity: The DPC substrate uses ceramics as the substrate, which has good thermal conductivity and can effectively conduct and dissipate the heat generated by high-power electronic 

devices, improving the reliability and performance of the devices.

 

High frequency characteristics are superior: DPC substrate has lower dielectric constant and loss, which can achieve lower signal transmission loss in high frequency and microwave frequency bands, making it 

suitable for high frequency and RF applications.

 

 

High density packaging capability: DPC substrates have high line density and thin line width/spacing capabilities, enabling more compact circuit layouts and higher line density, which is conducive to miniaturization

 and integrated design.

 

 

 

Excellent mechanical properties: The DPC substrate has high mechanical strength and hardness, and can resist environmental stresses such as vibration, impact, and thermal expansion, improving

 the reliability and durability of the device.

 

 

Good dimensional stability: The DPC substrate has a low coefficient of thermal expansion in high-temperature environments, which can maintain good dimensional stability and reduce the risk of mismatch and fracture 

caused by thermal stress.

 

 

Excellent welding performance: The copper film on the surface of the DPC substrate has good welding performance, which can achieve reliable circuit connection and welding.

 

 

High reliability and durability: The material and structural design of the DPC substrate make it highly reliable and durable, able to meet the requirements of harsh working environments and long-term use.


Overall, the copper clad ceramic substrate DPC process combines the thermal conductivity and excellent circuit performance of ceramic substrates, making it suitable for electronic devices that require high power, high frequency, and high reliability. It provides an important material choice for the electronic packaging industry.

 

The copper clad ceramic substrate (DPC) process is suitable for many high-power, high-frequency, and high reliability electronic devices and applications.

 

The following are some examples of products suitable for the use of copper clad ceramic substrate DPC process:

 

 

High power electronic devices: DPC substrates have excellent thermal conductivity in high-power electronic devices, and can be used for manufacturing power amplifiers, inverters, frequency converters, 

electric vehicle chargers, etc.

 

Radio Frequency (RF) and Microwave Devices: DPC substrates have low dielectric loss and excellent high-frequency performance, making them suitable for manufacturing RF power amplifiers, microwave 

antennas, RF filters, communication equipment, etc.

 

 

LED lighting: The excellent thermal conductivity of DPC substrate can help dissipate heat, improve the efficiency and lifespan of LED lighting, and is commonly used in the manufacturing of high brightness LED 

modules, LED packaging substrates, etc.

 

 

Automotive electronics: DPC substrate has a wide range of applications in the field of automotive electronics, which can be used to manufacture power electronic modules, battery management systems, and in vehicle communication devices for electric vehicles.

 

 

High temperature electronic devices: DPC substrates have good high-temperature stability and corrosion resistance, making them suitable for manufacturing electronic devices that work in high-temperature

 environments, such as aerospace equipment, gas turbine control systems, etc.


These are just some common examples, but in fact, the copper clad ceramic substrate DPC process can be applied to many other electronic devices that require high density, high thermal conductivity, and high 

reliability. The selection of specific products needs to be evaluated and determined based on factors such as application requirements, power requirements, frequency requirements, and reliability requirements. 


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