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FOLYSKY(WuHan) LTD.
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027-88111056
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13387504731
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FOLYSKY(WuHan) LTD.
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Room 8004, Block A, Building 1, Guanggu Science and Technology Port
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Technical Strength

Folysky Technology (Wuhan) Co., Ltd. focuses on the research and development of ceramic based circuit boards, and has the advantages of leading peers for the metallization process of various materials. At present, the products have been delivered, including the material types: alumina ceramic base, aluminum nitride ceramic base, zirconia, lead oxide, silicon carbide, silicon nitride, ZAT, glass, quartz, diamond, sapphire ceramic base, etc.

DPC(Direct Plate Copper) direct copper plating: through the use of evaporation, magnetron sputtering and other processes under high temperature and high vacuum conditions to metalize the substrate, first sputtering a layer of thin film transition metal on the surface of the substrate, and then the copper layer, and finally through a series of circuit board process.

Folysky has a mature process flow and a stable working team, which can realize plate interconnection (hole conduction), hole filling rate and other difficulties in the industry, fine line width and line distance (the minimum can be completed 50um), and the copper thickness range is 1-1000um. Customized services for different requirements of customers.

Multi-ceramic circuit board: The traditional thick film multilayer adopts the way of printing and sintering to achieve the preparation of multilayer circuit, which is to do each layer circuit separately (punching - filling - printing), and then realize the integral molding of the circuit sheet through the way of lamination - lamination - co-firing, and can not achieve too many layers of the circuit. Fuli Tiansheng uses advanced technology to sputter a ceramic thin film layer as a medium layer on the ceramic circuit board that has been metallized, and then complete the metal pattern of the second layer of the line on the generated ceramic layer. Compared with the traditional process, this method can realize more precise graphics production, and is suitable for high wiring, high capacity, high-level chip production, so that the final product can reach the characteristics of fine and thin.

Print Metallization Technoloy This technology is the product of the excellent research and development team of Wuhan National Optoelectronic Laboratory combining new materials and cutting-edge high-tech, through the combination of laser processing and new solder technology can print graphics on a variety of substrates. This technology is suitable for complex structural components and can realize three-dimensional circuit layout in real sense. At present, the samples have been completed in the laboratory, and the mass production test is in full swing.

As for traditional circuit boards, it is necessary to remove the plated material (dry film/ink) when making patterns, resulting in environmental pollution and waste. This technology directly exposes the shapes outside the line on the metallized substrate through laser processing, which saves process flow and materials, and is suitable for some specific products.

Laser drilling/cutting: The machine is equipped with the international first-class brand fiber laser, the optical path optimization makes the laser spot focus less than 50um, the minimum hole aperture up to 0.06mm, the minimum plate thickness of 0.1mm. Shape machining can carry out high-precision scribing, semi-cutting, cutting and other solutions to meet customer requirements.

The Times are developing, and the technology in the semiconductor field is also changing rapidly in the global context. In this environment, R&F Tiansheng Technology (Wuhan) Co., Ltd. closely follows the pace of the trend, and always maintains close contact and cooperation with Wuhan Guodian Laboratory, Huake College of Machinery and Engineering, Hubei Textile University and other scientific research units to master the cutting-edge information of science and technology in the industry. At the same time, we maintain in-depth discussions and exchanges with the forty-third Research Institute of China Electronics Technology Group Corporation, application-specific Integrated Circuit Technology Research Institute of Jiangsu Industrial Technology Research Institute, Southeast University-Wuxi Integrated Circuit Technology Research Institute and other major players in the industry, accurately grasp the pulse of the market, and are committed to providing customized services for new materials and new processes for global customers.

Because of stable product delivery and good after-sales service, the company has won the trust of customers in various industries such as medical, automotive, 5G communications, communications, aerospace and so on. Its downstream products are widely used in some well-known brand products, such as: Huawei, BYD, Taiwan Yiguang, Suzhou Minxin Micro, Chinese Academy of Sciences and so on.


contact information
contacts:Mr. Hu
cell phone:13387504731
Company address:Jiangxia District, Wuhan City

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