Large size laser cutting of nickel gold deposited on aluminum nitride ceramic substrate

Material: Aluminum nitride ceramic circuit board Plate thickness: 0.2mm Number of layers: single sided Copper thickness: 18um Surface treatment: deposited nickel gold Appearance processing: laser cutting Special p

Aluminum nitride ceramic support - double-sided dam - sunk nickel palladium

Substrate type: aluminum nitride Number of floors: double-sided+dam enclosure Thickness: 0.5mm Size: 54.5 * 109.2 π m Plate copper thickness: double-sided bottom copper 0.07mmt front dam 0.4mmt front step 0.2mm Copper thickness inside the h

Metallization of aluminum nitride ceramic structure - double-sided+dam - nickel palladium precipitation

Substrate type: aluminum nitride Number of floors: double-sided+dam enclosure Thickness: 0.38mm Size: 3X3MM (single) Plate copper thickness: double-sided bottom copper 0.07mmt, front dam 0.5mt, front step 0.2 π m Copper thickness inside the

Alumina ceramic circuit board - nickel plated palladium gold+silver plated

Substrate type: 96% alumina Number of layers: double-sided Thickness: 1.0mm Size: 70X80MM Board copper thickness: 0.035mm Copper thickness inside the hole: 0.035mm Line width and distance: 0.15/0.12mm Minimum aperture: 0.25mm Surfa

Alumina ceramic substrate 2.0mm green oil precipitated nickel gold

Material: alumina ceramic Plate thickness: 2.0mm Number of layers: double-sided Copper thickness: 65um Resistance welding: green oil Surface treatment: deposited nickel gold Appearance processing: water jet cutting Special process: th

Aluminum nitride ceramic circuit board 5050 rgbw silver deposit 0.5mm

Aluminum nitride ceramic circuit board 5050 rgbw silver deposit 0.5mm