Base material type: aluminum nitride ceramic

                    Base material thickness: 0.5mm

                    Conductive layer: copper, nickel, palladium, gold

                    Metal layer thickness: 980 μ M

                    Surface treatment: nickel and palladium precipitation

                    Metal single/double sided: double sided

                    Conducting hole: 0.1mm electroplated sealing hole

                    Solder resistance layer: None

Product Features

1. The bottom line is flat and suitable for gold wire bonding and binding.

2. The deviation of the dam body is within 15um,

3. The copper thickness of the dam body is 980um,

4. The edge of the dam body is perpendicular at right angles,

5. Thermal conductivity ≥ 170W/(m · K),

6. Dielectric constant 8-10MHz,

7. Withstand breakdown voltage ≥ 17KV/mm