Base material type: alumina ceramic base

Base material thickness: 3mm

Conductive layer: copper

Metal layer thickness: 100 μ M

Surface treatment: OSP

Metal single/double sided: double sided

Through hole: None

Solder resistance layer: None

Product Features

1. The overall dimensions of the substrate are not limited

2. Laser printed 3D wiring

3. No mask required, fast response speed

4. Mature technology, environmentally friendly and pollution-free