Base material type: aluminum nitride ceramic substrate

Thermal conductivity: 230W/(m · K)

Base material thickness: 0.38mm

Metal copper thickness: 18 μ M

Conductive layer: copper, nickel, palladium, gold

Line width and distance: 0.2/0.075mm

Conducting hole: 0.1mm electroplated hole filling

Surface treatment: nickel and palladium precipitation