1. Materials

① . 96% alumina ceramic ②. 99% aluminum nitride ceramic. Sapphire ④. High borosilicate glass

2. Conductor process

DPC (direct copper plating) 0.1-10oz LAM (laser copper plating) 0.1-10oz

3. Performance

Copper bonding force (N/cm2): ≥ 20 Thermal conductivity (W/m.K):

96% alumina ceramic 20-27 W/m K aluminum nitride ceramic 180-220 W/m K

Sapphire 27-30 W/m K high borosilicate glass 2-5 W/m K

Warpage degree (mm): ≤ 2%

4. Substrate material

Commonly used large material size mm: 120 * 120 127 * 127132 * 132140 * 130 190 * 140

Common large material thickness mm: 0.254 0.3810.5 0.6350.8 1.01.2 1.5 2.0

Among them, 1.21.52.0 needs to be customized in advance, with a customization time of 20 days

5. Drilling

5.1 Minimum aperture: 0.075mm

5.2 Aperture taper tolerance:+/-10%;

5.3 Borehole offset:+/-0.02mm;

5.4 Slot hole tolerance:

Length ≥ 2 times width: long edge+/-0.05mm, wide edge+/-0.025mm; Length<2 times width: long side+/-0.025mm, wide side+/-0.010mm;

6. Electroplating on one side and two sides

Table Copper Thickness (Ounces)

H/H 1/1 2/2 3/3 4/45/5 6/6 7/7 8/89/910/10 can achieve perfect sealing of the conductive hole through electroplating, achieving no hole marks on the surface of the conductive hole. Surface roughness of electroplated copper: ≤ 0.3UM

7. Line

7.1 Line alignment tolerance: ± 0.045mm;

7.2 Minimum line width and line spacing: 0.1/0.1mm;

8. Resistance welding

8.1 The unspecified ink thickness shall be controlled as follows (if the customer specifies the ink thickness, it shall be controlled according to the customer's requirements) Line surface: ≥ 10um; ② Line angle: ≥ 8um; ③ Substrate: ≥ 15um;

8.2 Cofferdam ink thickness: 70-120um;

8.3 Resistance welding alignment tolerance: ± 0.045mm;

8.4 Minimum width of solder mask wire: