99% alumina ceramic circuit board

Substrate type: 99% alumina ceramic circuit board Base material thickness: 1.0mm Conductive layer: copper, nickel, palladium, gold Metal layer thickness: 300 μ M Surface treatment: nickel palladium Metal single/double si

Ceramic metallization

Base material type: 96% Al2O3; 96% AlN

Glass substrate 1.0mm copper clad 35um

Glass substrate thickness 1.0mm, copper clad metal thickness 35um

Large size laser cutting of nickel gold deposited on aluminum nitride ceramic substrate

Material: Aluminum nitride ceramic circuit board Plate thickness: 0.2mm Number of layers: single sided Copper thickness: 18um Surface treatment: deposited nickel gold Appearance processing: laser cutting Special p

Aluminum nitride surface full plate copper coating

Aluminum nitride surface full plate copper coating

Sensors - Alumina substrates - Metallized half pores - Deposited nickel palladium gold

Substrate type: alumina Number of layers: double-sided Thickness: 0.50mm Size: 3.5X3.5MM (single) Board copper thickness: 35um Copper thickness inside the hole: 30um Line width and distance: 0.2/0.15mm Minimum aperture: 0.15mm Surf