Aluminum oxide large-sized ceramic circuit board

Special type: large size Base material thickness: 2.0mm Conductive layer: copper nickel palladium Metal layer thickness: 100 μ M Surface treatment: nickel palladium Metal single/double sided: double sided Through

Sealed copper pillar ceramic circuit board

Special type: sealed copper column Base material thickness: 1.0mm Conductive layer: copper, nickel, gold Sealing hole diameter: 0.2mm Copper column thickness: 500um/300 μ M Surface treatment: nickel gold Metal sin

Aluminum oxide blind slot circuit board

Special type: blind slot design Base material thickness: 0.5mm Conductive layer: copper nickel palladium Metal layer thickness: 30 μ M/20 μ M Surface treatment: nickel palladium Metal single/double sided: double sided

Aluminum oxide ceramic cooling sheet copper clad plate

Base material type: aluminum nitride ceramic Base material thickness: 0.38mm Metal layer thickness: 350 μ M Surface treatment: nickel and palladium precipitation Metal single/double sided: double sided Through hole: None

Aluminum nitride ceramic PCB

Base material type: aluminum nitride ceramic Base material thickness: 0.38mm Metal layer thickness: 350 μ M Surface treatment: nickel and palladium precipitation Metal single/double sided: double sided Through hole: None

Aluminum nitride ceramic cooling sheet copper clad plate

Base material type: aluminum nitride ceramic Base material thickness: 0.15mm Metal layer thickness: 18 μ M Surface treatment: nickel and palladium precipitation Cutting method: water jet cutting, with a blue film on the back