Ceramic drilling

1. Material: ①. 96% alumina ceramic ②. 99% aluminum nitride ceramic ③. Sapphire ④. High borosilicate glass 2 conductor process: DPC (direct copper plating) 0.1-10oz; LAM (Laser Attached Copper) 0.1-10oz 3. Performance: Copper bonding force (N/cm2):

Ceramic Metallization DPC Technology

Thin film method is the main method for metal film deposition in microelectronics manufacturing, with direct plating copper being the most representative.

Large size laser cutting of nickel gold deposited on aluminum nitride ceramic substrate

Material: Aluminum nitride ceramic circuit board Plate thickness: 0.2mm Number of layers: single sided Copper thickness: 18um Surface treatment: deposited nickel gold Appearance processing: laser cutting Special p

Semiconductor refrigeration sheets - Aluminum oxide copper clad sheets - Double sided - Deposited nickel palladium

Substrate type: alumina Number of layers: double-sided Thickness: 0.25mm Size: 2.2X3MM (single) Plate thickness copper: 18um Copper thickness inside the hole:/ Line width and distance: 0.2/0.1mm Minimum aperture:/ Surface treatment

3570 aluminum nitride 0.38mm gold plated conductive layer copper

3570 aluminum nitride 0.38mm gold plated conductive layer copper

Sliton silicon nitride ceramic substrate

Substrate Name: Sliton Silicon Nitride Ceramic Substrate Base material thickness: 0.25m Conductive layer: copper Metal layer thickness: 200 μ M/200 μ M Surface treatment: sinking gold Ceramic circuit board supplier: Sliton Metal single/d