Aluminum nitride ceramic circuit board 5050 rgbw silver deposit 0.5mm

Aluminum nitride ceramic circuit board 5050 rgbw silver deposit 0.5mm

Aluminum Nitride Ceramic Substrate 5050 rgbw Gold Deposition 0.5mm

Aluminum Nitride Ceramic Substrate 5050 rgbw Gold Deposition 0.5mm

Aluminum nitride ceramic substrate - silver deposition - special process: small spacing

Substrate type: aluminum nitride Number of layers: double-sided Thickness: 0.50mm Size: 3.5X3.5MM (single) Board copper thickness: 18um Copper thickness inside the hole:>18um Line width and distance: 0.3/0.07mm Minimum aperture: 0.2mm

Sliton silicon nitride ceramic substrate

Substrate Name: Sliton Silicon Nitride Ceramic Substrate Base material thickness: 0.25m Conductive layer: copper Metal layer thickness: 200 μ M/200 μ M Surface treatment: sinking gold Ceramic circuit board supplier: Sliton Metal single/d

Sliton silicon carbide ceramic substrate

Substrate Name: Sliton Silicon Carbide Ceramic Substrate Base material thickness: 0.3m Conductive layer: copper Metal layer thickness: 70 μ M/70 μ M Surface treatment: sinking gold Ceramic circuit board supplier: Sliton Metal single/doub

Three layer dam sinking nickel palladium ceramic substrate

Material: Alumina ceramic substrate Plate thickness: 0.5mm Number of layers: double-sided Copper thickness: 100um Resistance welding: black oil Surface treatment: nickel and palladium precipitation Appearance processing: water jet cuttin