With the development of society, the progress of industry, and the refinement of the process, the development of the PCB industry is also getting better and better, and the process performance is also becoming more and more exquisite and advanced. Whether it is a hard board or a soft board or a combination of soft and hard versions, or a ceramic substrate with the best heat dissipation performance, it tells us that innovation is unlimited!

At present, about the ceramic substrate more mature alumina ceramic circuit board, aluminum nitride ceramic circuit board, many companies can do 3535, 5050, 7070, etc. Fuli Tiansheng Technology (Wuhan) Co., Ltd. can accept customer customization, no matter what specifications can be made, but must meet the line spacing greater than 20 microns, It is also the use of fully automated production, without too much manpower, but also to avoid a lot of process mistakes.

Such a chaoyang enterprise that attaches importance to scientific research technology and user experience not only provides corresponding protection for employees, but also brings a more comprehensive and mature user experience to customers. For possible problems such as copper spatter falling off and bubbles, Slitong's process is also quite mature. General circuit board industry requirements are that the binding force can reach 18-30 mpa. The falling off is because the combination strength is not enough, the combination strength of our products is 45 mpa, that is, the thrust value and tension value are 45 mpa, so it will not fall off after welding. The thickness of the copper coating can be made according to the needs of customers to 0.001-1mm, the general copper coating 0.03mm, the error is +/-0.005mm, and the copper conduction will not be burned out in the later period. This product is mainly found in products requiring high heat dissipation, general aerospace, automotive electronics, lighting, high-power electronic components, to maximize product performance.

The ceramic PCB we use is at the leading level in the industry and can be quickly customized to meet customer needs. Ceramic metallized substrate has good thermal and electrical properties, is an excellent material for power type LED packaging, violet light, ultraviolet, especially suitable for multi-chip packaging (MCM) and substrate direct bonding chip (COB) package structure, but also can be used as other high-power power semiconductor module cooling circuit board, High current switches, relays, antennas, filters, solar inverters for the communication industry, etc.

The ceramic PCB industry is estimated to have a market value of $6 billion in the smart lighting market, and beat most "sunrise industries" at an annual growth rate of 7%, becoming an emerging high-tech enterprise in the industry, and has a wide range of applications in subway, rail transit, IGBT, new energy vehicles and other aspects.

In today's broad market prospects, R&F Tiansheng focuses on the production of world-class quality ceramic substrates, enhance brand influence, focus on scientific research and development and high-tech applications, to provide you with timely, intimate, cost-effective services.

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