FOLYSKY（WuHan） LTD.
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027-88111056
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13387504731
FOLYSKY（WuHan） LTD.
In recent years, the application fields of metallized ceramic circuit (substrate) boards have become increasingly widespread, including LED level I packaging substrates, LED level II system boards, LED COB circuit boards, IGBT power module substrates, automotive electronic circuit boards, refrigeration chip boards, HCPV circuit boards, medical electronic product circuit boards, and so on. All of these are attributed to the excellent insulation, voltage resistance, physical properties, chemical stability of ceramic materials Its high cost-effectiveness thermal conductivity characteristics (alumina thermal conductivity of about 20-27W/m · K, aluminum nitride thermal conductivity of about 170-190/m · K) and other advantages.
Due to the requirements of related applications, ceramic substrates mostly require the production of wires on both surfaces of the substrate, and most of them require the structure of filling conductive materials (Through Hole Via Filling) through conductive holes to connect double-sided wires. Additionally, some require excessive current to seal the holes, and electroplating copper to fill the conductive holes is currently one of the widely used processes for filling conductive holes. However, currently, it is difficult to fill through holes through electroplating. There are many factors that affect the quality of its electroplating sealing, which are related to factors such as machine equipment, material conditions, electroplating techniques, and electroplating solutions. To solve the problems faced by DC electroplating in sealing process, our company adopts pulse electroplating technology. Pulse electroplating is actually a type of on/off DC electroplating, where positive and negative pulses are followed by reverse pulses, which are output alternately according to the set cycle. Pulse electroplating technology can improve the quality of coatings. Compared to electroplating coatings formed by direct current power, pulse electroplating coatings have better deep plating ability, corrosion resistance, wear resistance, purity, conductivity, welding, and color resistance, and can significantly shorten electroplating time and reduce costs; Therefore, it is widely used in electroplating processes with functionality and special needs.
A good pulse power supply must have stable output current (<± 1%), wide power operation range, adjustable output frequency, low arc energy, high compatibility and scalability. Generally speaking, the main adjustable parameters of pulse electroplating include the proportion of positive and negative pulse currents, the frequency of positive and negative pulse currents, and so on. In addition, multi-stage programmable control can meet the needs of process parameter adjustment.
In the application of LED products, ceramic substrates often use specifications with thicknesses of 0.38mm and 0.5mm, and the size of their through holes is usually set in the range of 0.070 to 0.110mm. Based on the experience of the development of electroplating sealing to this day, pulse electroplating sealing is a stable process that is easy to achieve and has good reproducibility, provided that the conductive seed layer film inside the conductive hole is in a continuous and normal state, and the depth to width ratio (substrate thickness: conductive hole diameter) of the conductive hole is designed in the size range of 4:1 to 6:1. In addition, with the high thermal conductivity and heat dissipation application requirements of high-power modules, a diameter of 100 can also be established through pulse electroplating on an Al2O3 substrate with a thickness of 0.635mm μ M~310 μ The thermal conductivity column structure of m aims to improve the thermal conductivity of Al2O3 substrate by establishing copper thermal conductivity columns, in order to replace the application of high cost AlN substrate.
With the increasing demand for product power density, more components may be placed on ceramic substrates per unit area, resulting in the need for more through holes. However, in situations where the area is limited, the number of through holes increases and the diameter continuously shrinks (with an increase in aspect ratio). The sealing quality of through holes is the key to the quality and yield of the product. Therefore, our company's electroplating sealing process will continue to play a crucial role.
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