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Ceramic substrate materials are widely used in fields such as power electronics, LED packaging, and multi chip modules due to their excellent thermal conductivity and airtightness. The selection of LED heat dissipation substrate also varies in design depending on the circuit design, size, luminous efficiency, and other conditions of the LED. The most common ones on the market can be distinguished as follows:
① System circuit boards are mainly used as heat dissipation systems for LEDs to transmit heat energy to the atmosphere, fins, or shells. The types of system circuit boards listed include: aluminum substrates (MCPCBs), printed circuit boards (PCBs), and flexible printed circuit boards (FPCs);
② LED chip substrate is a medium for thermal energy export between LED chips and system circuit boards, and is combined with LED chips through eutectic or cladding. In order to ensure the stability of LED heat dissipation and the luminous efficiency of LED chips, many recent applications of ceramic materials as high-power LED heat dissipation substrates mainly include: low-temperature co fired multilayer ceramics (LTCC), high-temperature co fired multilayer ceramics (HTCC), directly bonded copper substrates (DBC), directly plated copper substrates (DPC), and laser rapid activation metallization technology (LAM). The following article will delve into the types of ceramic LED chip substrates.
Definition and performance of ceramic substrates:
1. Definition: A ceramic substrate is a sheet like material based on electronic ceramics, which forms a supporting base for membrane circuit components and external cutting components. According to the different application fields of ceramic substrates, they can be further divided into HIC (hybrid integrated circuit) ceramic substrates, focusing potentiometer ceramic substrates, laser heated fixing ceramic substrates, chip resistance substrates, network resistance substrates, etc; According to different processing methods, ceramic substrates are divided into two categories: molded sheets and laser marking sheets.
2. Performance of ceramic substrates:
(1) Mechanical properties
Having sufficiently high mechanical strength, it can also be used as a supporting component in addition to carrying components;
Good processability and high dimensional accuracy; Easy to achieve multi-layer;
The surface is smooth, without warping, bending, microcracks, etc.
(2) Electrical properties
High insulation resistance and insulation failure voltage;
Low dielectric constant;
Low dielectric loss;
Stable performance under high temperature and humidity conditions, ensuring reliability.
(3) Thermal properties
High thermal conductivity;
Match the thermal expansion coefficient with relevant materials (especially with the thermal expansion coefficient of Si);
Excellent heat resistance.
(4) Other properties
Good chemical stability; Easy to metallize, circuit graphics have strong adhesion to them;
No hygroscopicity; Oil and chemical resistance; α Low radiation emission;
The substances used are environmentally friendly and non-toxic; The crystal structure remains unchanged within the temperature range of use;
Abundant raw materials; Mature technology; Easy to manufacture; The price is low.
Comparison between ceramic substrate and metal substrate:
LED heat dissipation substrates are mainly divided into metal substrates and ceramic substrates. The metal substrate is made of aluminum or copper, which is currently used in general LED products due to its mature technology and low-cost advantages. The ceramic substrate circuit has high alignment accuracy and is widely recognized as a material with excellent thermal conductivity and heat dissipation performance in the industry. It is currently the most suitable solution for high-power LED heat dissipation. Although the cost is higher than metal substrates, the lighting requirements for heat dissipation and stability are higher than electronic products such as laptops and televisions. Therefore, international manufacturers such as Cree, OSRAM, Philips, and NIA all use ceramic substrates as LED grain heat dissipation materials.
In recent years, the application fields of metallized ceramic circuit (substrate) boards have become increasingly widespread, including LED level I packaging substrates, LED level II system boards, LED COB circuit boards, IGBT power module substrates, automotive electronic circuit boards, refrigeration chip boards, HCPV circuit boards, medical electronic product circuit boards, and so on. All of these are attributed to the excellent insulation, voltage resistance, physical properties, chemical stability of ceramic materials Its high cost-effectiveness thermal conductivity characteristics (alumina thermal conductivity of about 20-27W/m · K, aluminum nitride thermal conductivity of about 170-190/m · K) and other advantages.
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