Sliton is a professional manufacturer of high-performance metallized LED substrates and bases, utilizing various technologies suitable for specific customer needs. Whether it is performance characteristics, power levels, or assembly methods, it is at the world's top level.

The production processes used by Sliton include LTCC (Low Temperature Co firing Technology), HTCC (High Temperature Co firing Technology), DBC (Direct Copper Cladding Technology), and DPC (Copper Plating Technology). Manufacturing technology and processes enable Sliton to provide affordable LED substrates without compromising quality or performance.

Sliton's high-performance ceramics can provide 1 μ M-1mm thick copper metallization layer. The tin, nickel, and gold surfaces on bare copper can use various interconnection technologies: RoHS welding, gold and aluminum wire bonding, epoxy and high-temperature chip bonding, and flip chip bonding.

In addition, low-cost gold tin electroplating can be selectively applied to basic metallization, with a protective cover layer that prevents oxidation and ensures seamless solder joints. Combining fine thread capability with 20 μ The narrow gap of m makes Sliton's substrate an ideal choice for installing flip chip and "bonding pad" GaN, making it an ideal choice for GaAs and other LED devices.

The Sliton LED ceramic substrate uses high thermal conductivity ceramic materials (up to 280 W/Mx oC) and thick copper rails with a resistivity of less than 1m Ω/square, achieving excellent thermal management. Parts can be provided to customers in large multi image formats for automatic assembly, thereby reducing product costs. Otherwise, the parts can be separately supplied with vacuum dust packaging.

Therefore, Sliton is now able to provide reliable solutions for substrates with competitive prices. Low upfront mold costs and fast turnaround time enable designers to quickly put products into the market and reduce engineering costs.

Sliton is a company that complies with RoHS standards, ISO 9001:2008 registration, and national standards. We provide ceramic packaging solutions for optoelectronics, microwave/RF components and modules, as well as DC power electronic equipment. Applications include high-performance lasers, photodiodes and LED substrates, optoelectronic circuits, isolators, power modules, RF power amplifiers and TC modules, among others.

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