Welcome to the official website of FOLYSKY(WuHan) LTD.!
         |   ENG
FOLYSKY(WuHan) LTD.
hotline:
027-88111056
technical:
13387504731
News Center
News Center
current location > News Center > News
News Center
FOLYSKY(WuHan) LTD.
Address:
Room 8004, Block A, Building 1, Guanggu Science and Technology Port
Follow us:
Contact Us
  • cell phone:13387504731
  • wechat:yjqp3344
  • email:market@folysky.com
The Strong Layout of Slighton Ceramic Substrate greets the Dinner (Part 1)
Release time:2022-03-10 14:04:08  Author:富力天晟  Reading volume:300

  

In the current electronic age, almost everyone has their own electronic devices. Nowadays, electronic devices are not only limited to mobile phones and computers, but also have become "electronic devices" driven by the Internet of Things. The Internet of Things, based on the Internet, is rapidly developing. Unmanned driving, smart home, and smart wear are all like flowers in spring, blooming in clusters. Of course, this is also the "spring" of the electronic manufacturing industry.


  

But why did the "spring" of electronic manufacturing come so late? There are many factors involved, such as the promulgation of the "Made in China 2025" strategy, the arrival of "Industry 4.0", and the arrival of ceramic substrates. In 2014, Premier Li Keqiang officially proposed the concept of "Made in China 2025", which was already issued by the State Council in 2015. However, before 2014, China's manufacturing industry was in a relatively disadvantaged position. The manufacturing industry was the main body of the national economy, the foundation of establishing a country, the tool of revitalizing the country, and the foundation of a strong country. Since the beginning of industrial civilization in the mid-19th century, the rise and fall of world powers and the struggle of the Chinese nation have repeatedly proven that without a strong manufacturing industry, there can be no prosperity for a country or a nation. Building a manufacturing industry with international competitiveness is a necessary path for China to enhance its comprehensive national strength, ensure national security, and build a world power. A new round of technological revolution and industrial transformation is quietly taking place. We must firmly seize this major historical opportunity in order to build China into a manufacturing power that leads the development of the world's manufacturing industry and lay a solid foundation for realizing the Chinese Dream of the great rejuvenation of the Chinese nation.

 

 

 

In China's manufacturing industry, there is a very important industry called the materials industry, and the research and development of new materials has a profound impact on the process of manufacturing in China. The ceramic substrate industry just mentioned belongs to the industry derived from new material research and development. Every new material research and development that conforms to the market is enough to trigger an iterative wave in the electronics industry - ceramic substrates are no exception.

 

 

 

What are the benefits of using ceramic substrates?

 

 

 

At present, PCBs on the market can be mainly divided into three types based on material categories: ordinary substrates, metal substrates, and ceramic substrates. Ordinary substrates are the motherboards in computers and mobile phones that we usually see. They are all ordinary epoxy resin substrates, which have the advantages of easy design and low cost. Therefore, they are still widely used today.

 

 

 

There are three main types of metal substrates: aluminum substrate, copper substrate, and iron substrate. Iron based boards are considered a pseudo proposition and have not been applied in the market, so they are gradually forgotten by people. Aluminum substrate is currently the most commonly used substrate among metal substrates. Aluminum substrate has a thermal conductivity 10 times higher than epoxy resin substrate, so it is generally used in high-power electronic devices. Copper substrate and aluminum substrate are the same, and the thermal conductivity of copper substrate is even better than that of aluminum substrate.

 

 

 

Ceramic substrates can also be divided into two types based on material: alumina ceramic substrates and aluminum nitride ceramic substrates. The thermal conductivity of alumina ceramic substrate is approximately 10 times that of metal substrate, close to 100 times that of epoxy resin substrate. The thermal conductivity of aluminum nitride ceramic substrate is 10 times that of alumina ceramic substrate, 100 times that of metal substrate, and 1000 times that of epoxy resin substrate. In addition to thermal conductivity, ceramic substrates also have many advantages of ceramic materials, such as high pressure resistance, high temperature resistance, corrosion resistance, low medium loss, and so on.

 

 

 

Ceramic materials were successfully developed by General Electric in the United States as early as 1943, but why did it take so long for China and even the world to begin the application of ceramic substrates?



Skype
contact information
contacts:Mr. Hu
E-mail:market@folysky.com
cell phone:13387504731
Company address:Jiangxia District, Wuhan City

Follow us

customer service

FOLYSKY(WuHan) LTD. Copyright © 2016 all rights reserved  备案号:鄂ICP备17008273号-1