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FOLYSKY（WuHan） LTD.
Preface: LED grain size packaging (CSP) and aluminum nitride ceramic substrates will quickly emerge in the high-power LED market.
CSP and aluminum nitride substrates, respectively, can save on packaging and wire rack costs, as well as improve heat dissipation efficiency. Therefore, they have become two important technologies for reducing the production cost and extending the service life of high-power LEDs, and have received high attention from the market.
The influence of grain level packaging (CSP) and aluminum nitride ceramic substrates has risen. With the rapid increase in penetration rate of the LED lighting market, the demand for high-power LEDs has also increased with the tide. In order to accelerate the popularization of the LED lighting market, LED grain and Sliton suppliers are respectively stepping up their investment in CSP and aluminum nitride ceramic substrate layouts to reduce the unit price of high-power LEDs and extend their lifespan.
The two major issues in LED lighting today are improving light quality and lowering prices to stimulate market demand. Therefore, unpackaged white light LEDs are expected to leverage their advantages in optical shape, color rendering, and light control, as well as reduce costs through new design architectures, quickly emerging in the market.
CSP packaging solutions have launched a strong attack on LED indoor lighting and are optimistic about the development potential of CSP technology. Sliton has started global layout, conducting research and development and production of CSP and COB related substrates.
Sliton stated that in response to market demand, laser activated metallization technology has been adopted to develop CSP ceramic substrate products, which can be used under high driving currents, ensuring high luminous efficiency and thermal stability of LEDs; At the same time, it can significantly reduce the packaging size to only 16 millimeters × 16mm, breaking through previous size limitations, provides users with higher flexibility in lamp development and helps to explore emerging applications such as interior mirrors.
In addition, the CSP ceramic substrate released by Sliton has been able to achieve a cold white LED of 2 watts, a luminous efficiency of 110lm/W, and a color rendering index (CRI) of 80, which will help customers become more competitive in lighting design costs.
In addition, Sliton emphasizes that the CSP ceramic substrate has a small volume, which can provide higher flexibility in secondary optical design and emit high-intensity light sources in very small spaces, accelerating the entry of LED lighting into the era of point light technology.
Currently, Sliton has sent samples of CSP ceramic substrates to early customer groups for product validation and testing, and is expected to enter mass production as soon as the end of 2017.
It is understood that due to the fact that CSP ceramic substrates can be directly imported into the lighting system without the need for wire racks and wiring steps, Sliton's main target customers are not only LED lighting fixture factories, but also lighting module factories that can assist lamp manufacturers in accelerating the product launch process, which is also a focus of expansion.
In addition to CSP ceramic substrates, Sliton also introduces COB ceramic substrate packaging products, which also saves the wiring step. Compared to traditional COB processes, it not only reduces the risk of wire breakage, but also reduces manufacturing costs.
Sliton pointed out that both COB ceramic substrate and CSP ceramic substrate use laser activated metallization technology, which can provide LED with a light flux greater than 15000 lumens in a small area. Compared to traditional COB, it can increase the light output by nearly twice, thus completely replacing metal halide (CMH) light sources.
At present, aluminum nitride ceramic heat dissipation substrates are mainly used for outdoor high-power LED lighting, mainly due to a price difference of twice that of traditional aluminum oxide. It is expected that in the future, the unit price will be equivalent to that of aluminum oxide, and it is expected to accelerate its penetration into the indoor lighting market.
It can be expected that once CSP and aluminum nitride ceramic substrates are commercialized in large quantities, the price and reliability of high-power LEDs in the future will be more competitive than traditional light sources, rapidly expanding their influence in the lighting market and accelerating the arrival of the era of LED lighting popularization.
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