FOLYSKY（WuHan） LTD.
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FOLYSKY（WuHan） LTD.
Ceramic substrates were initially applied in some special fields, but in recent years, with the rapid development of LED lighting, they have emerged from the PCB family. LED lighting products mainly consist of three main structures: light source, power supply, and substrate. As one of them, the substrate accounts for a large part of the cost of the entire lamp.
The rapid development of LED lighting applications has brought infinite vitality to ceramic substrates, and the ceramic substrate industry has emerged like a bamboo shoot after a rain. Overnight, it is everywhere. From traditional large-scale PCB manufacturers to home workshops, as well as some ceramic substrates, they all joined forces to compete for the cake of LED lighting.
At the same time, the competition in the LED auxiliary material market is no less intense than in the downstream application field of finished products, with significant differences in ceramic substrates and a mixed bag of fish and dragons. To break through this' Red Sea ', one must have a clear positioning and the ability to develop core technologies.
New technologies and innovations
The technological innovation of ceramic substrates is more focused on packaging, and improvements are made to address some of the issues that arise in the packaging process. Therefore, new packaging forms are particularly attracting attention from ceramic substrate companies, especially COB packaging.
As soon as COB packaging was introduced, it has attracted attention from various aspects due to its advantages such as low thermal resistance, high light efficiency, no soldering, and low cost. It has been hailed by industry experts as one of the top ten trends and hotspots in future LED packaging technology. However, COB packaging is not as good as people imagine and has not been quickly accepted by the market. At present, it is only used on a few tube lamps, so what is hindering its popularity?
The thermoelectric problem of high-power LEDs has always plagued their applications.
In addition, due to objective reasons, the points where COB packaging is wired and bound may undergo vulcanization, which can lead to yellowing after chip packaging and ultimately affect light aging. This is one of the cancers that affects the widespread popularity of COB. It is difficult to avoid the current packaging process caused by conductive purposes after packaging integration.
In the LED lighting industry, heat conduction and heat dissipation issues are currently an important aspect of lighting design, especially the heat dissipation of high-power LEDs, which has always been a bottleneck. If the heat conduction and heat dissipation issues are not resolved during the design process, this product is highly likely to be a waste product! Moreover, the issue of heat conduction has not been resolved, and the radiator, no matter how large it is, is useless.
The majority of LED electrical energy is converted into thermal energy, causing a sharp decline in device lifespan. Due to the high thermal conductivity and good heat dissipation of ceramics, they can effectively export internal heat. Therefore, most high-power LEDs and LED lamps currently used are welded with LED tubes on ceramic substrates, which are then bonded to the heat sink through thermal conductive adhesive.
The heat generated by LEDs is transmitted to the ceramic substrate, and then through the thermal interface material to the heat sink, which can diffuse the majority of the heat generated by LEDs into the surrounding air through convection.
Sliton has now applied technology to ceramic substrates, resulting in a dedicated ceramic substrate for COB. This not only effectively solves the heat dissipation problem of packaging, but also perfectly overcomes the sulfurization phenomenon of COB and improves light efficiency.
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