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FOLYSKY（WuHan） LTD.
Many of the common ceramic PCB circuit boards we know before, with the continuous changes in the industry, aluminum nitride AIN ceramic circuit boards began to become more recognized by cooperative enterprises, in the Silitong ceramic circuit boards, there are also most aluminum nitride ceramic substrates are more popular.
AlN can be stabilized up to 2200℃. The strength of room temperature is high, and the strength decreases slowly with the increase of temperature. Good thermal conductivity, small thermal expansion coefficient, is a good heat resistant impact material. Strong resistance to molten metal erosion, it is an ideal crucible material for melting and casting pure iron, aluminum or aluminum alloy. Aluminum nitride is also an electrical insulator with good dielectric properties and is also promising as an electrical component. The aluminum nitride coating on the surface of gallium arsenide protects it from ion implantation during annealing. Aluminum nitride ceramic circuit board is also a catalyst from hexagonal boron nitride to cubic boron nitride. Reacts slowly with water at room temperature. It can be synthesized by aluminum powder at 800~1000℃ in ammonia or nitrogen atmosphere, and the product is white to gray blue powder. Or by Al2O3-C-N2 system reaction synthesis at 1600~1750℃, the product is gray white powder. Or aluminum chloride and ammonia by gas reaction. The coatings can be synthesized from AlCl3-NH3 system by vapor deposition. Often we are familiar with AlN+3H2O== catalyst ===Al (OH) 3↓+NH3↑
Similarly, after we understand the concept of aluminum nitride, we should be more clear about the characteristics of Slitong Aluminum nitride AIN aluminum nitride ceramic circuit board:
(1) High thermal conductivity (about 320W/m·K), close to BeO and SiC, which is more than 5 times that of Al2O3;
(2) the thermal expansion coefficient (4.5 x 10-6 ℃) and Si (3.5 ~ 4 x 10-6 ℃) and GaAs (6 x 10-6 ℃) matching;
(3) various electrical properties (dielectric constant, dielectric loss, body resistivity, dielectric strength) excellent;
(4) Good mechanical properties, folding strength higher than Al2O3 and BeO ceramics, can be sintered under normal pressure;
(5) High purity;
(6) Good optical transmission characteristics;
(7) non-toxic;
(8) Can be made by casting process. It is a promising substrate and packaging material for high power integrated circuits.
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