In order to meet the needs of the current terminal mobile phone 3D sensing, automotive optical reach and optical fiber transmission, the market size of infrared components has gradually grown in recent years, of which VCSEL chips have the most significant growth rate.
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1、Since the release of Apple's iPhone X series in 2018, Android mobile phone manufacturers have opened the layout of 3D induction in an all-round way. According to public information, after OPPO released the first TOF camera in 2018, vivo, Huawei, Samsung, LG, Lenovo and other companies have also released models equipped with ToF cameras.
To this end, Slitone has assembled alumina ceramic circuit boards and aluminum nitride ceramic circuit boards that are more suitable for TOF technology.
Generally, the thermal conductivity of alumina ceramic circuit board is 17-23W/m.K, but it can be made according to the special preparation method and material formula, which can make the alumina ceramic circuit board reach about 220W/m.K. The thermal conductivity of aluminum nitride ceramic circuit board is 10 times that of alumina circuit board, which can directly reach 170-230W /m.K, providing customers with different options.
Whether it is an alumina ceramic circuit board or an aluminum nitride ceramic board, the line/pitch (L/S) resolution of the circuit board can reach 20μm, which can realize the integration and miniaturization of the equipment, so as to meet the small, light and thin requirements of the TOF camera.
2、In addition to the wave of 3D sensing face recognition applications driven by Apple mobile phones, VCSEL components have been gradually extended to the field of automotive light, trying to replace the original divergent EEL light source through the light energy concentration, beam Angle and shape characteristics of VCSEL components.
To this end, Slitong has developed a ceramic circuit board that is more suitable for automotive light, ensuring that the thermal expansion coefficient of ceramic and chip is close, the service life is long without organic components, and the breakdown resistance voltage can be as high as 20KV/mm, ensuring that the automotive VSCEL needs are met.
And according to the vertical structure of VSCEL, the DPC film technology is used to ensure that the metal layer and ceramic bonding force is more stable, high flatness and high reliable vertical interconnection package effect is better, and the pasting process and coordination accuracy problems in the later assembly process are eliminated.
3、In addition, due to the recent fermentation of 5G issues, the needs related to components in the field of optical communication, such as the data transmission capacity, bandwidth and distance of optical fiber, will also be the focus of subsequent development; The VCSEL component attempts to replace the traditional LED light source and provide optical fiber application modules with a wavelength of 850nm and a bandwidth of 5 to 200Gbps, thereby improving the overall 5G transmission.
To this end, Slitong uses DPC technology ceramic circuit board with its unique advantages of low dielectric constant and dielectric loss, good heat dissipation, conductive thickness can be customized within 1μm - 1mm, low high-frequency loss can be designed and assembled for high frequency circuit to achieve VSCEL expansion and optimized development and progress.
As the ceramic support enterprise of the core chip of VCSEL products, Slitong will continue to develop better and more efficient ceramic circuit boards, become a solid supporter of the VCSEL market, and contribute to a more intelligent and convenient life in the world.
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