With 2019 officially entering the "first year of 5G", the trend of ultra-high-definition video transmission and "multi-photography" on smartphones has ushered in a new round of explosive growth in demand for CIS.

CIS is regarded as one of the keys to the image sensor market and has been attracting market attention. As a rich experience in domestic IC packaging materials, Slitong began to prepare for the operation of ceramic substrate packaging very early, and has accumulated rich experience in product management and technology. Faced with such a large supply gap in the CIS market, Sliton actively cooperated with the CIS market to make efficient and high-quality products.

Technology leads the future, innovation drives development, we were born to meet modern needs, determined to promote the development of the electronics industry with scientific and technological innovation. This has always been the consistent vision of Silitong, we continue to explore new areas of application, to promote the overall development of enterprises.

The materials used in Silitong ceramic circuit board are 99% alumina ceramics with thermal conductivity of 20~27W/m.K, 96% aluminum nitride ceramics of 170~230W/m.K, sapphire of 27~30W/m.K and high borosilicate glass of 2~5W/m.K, and the warpage degree of plane ceramic circuit board and three-dimensional ceramic circuit board is strictly ≤3‰. At the same time, the thickness of the ceramic circuit board can be controlled at 0.254mm, 0.381mm, 0.5mm and other different thicknesses, and the material size can also be controlled at 120*120mm, 127*127mm, 132*132mm and other different sizes, which can fully meet the packaging requirements of CIS. Our ceramic circuit board uses electroplating to seal holes, we can achieve no hole traces on the surface of the through hole, and ensure that the surface roughness is controlled within 0.3μm. Silitong ceramic circuit board production process does not need to open mold, according to the requirements of the drawing of the ceramic type, metal layer thickness, line distribution and other needs of production, can 100% meet customer needs.

CIS has a wide range of application prospects, in addition to the mobile phone market, but also such as the car market, security market in different fields of application. To this end, in order to meet different application needs, Silitong has developed different scenarios and applications of technical solutions, some of the solutions have begun production implementation, details can come to consult.

CIS market has been a strong attack, all-round penetration development, Silitong will continue to improve technological innovation, research and development of better packaging materials, continue to develop more advanced, more effective, more efficient products, we will continue to work hard for the development of the electronics industry, so as to bring better product experience to the market.

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