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FOLYSKY（WuHan） LTD.
In recent years, the number of smartphone cameras has multiplied, making CIS (COMS image sensors) a focus that cannot be ignored in the market, forming one of the hottest areas in the semiconductor industry.
The market demand for CIS has increased rapidly, and large CIS suppliers such as SONY, Samsung, and Howe have increased their production efforts, but still cannot meet the supply demand of CIS. In such an urgent situation, the foundry and sealed test factories that are good at CIS also benefit greatly, and the production capacity is extremely tight. In addition to the smartphone application field, automotive electronics, security monitoring and other application fields are also closely followed, making the CIS market a place of attention.
01、 CIS advantages, technical difficulties
CIS is considered to be the most promising because of its cost-effectiveness, fast processing speed and low power consumption. With its advantages of small size, low power, easy integration, faster frame rate and lower manufacturing cost, it occupies the image sensor market, but it still cannot avoid facing technical difficulties - heat dissipation, sensitivity, signal noise and so on.
Thermal management to improve CIS life
The CIS optical signal acquisition method is active, and the charge generated by the photodiode is directly amplified by the transistor. When it processes rapidly changing images, the current changes frequently and the flow rate increases, which causes it to overheat.
Increased sensitivity, increased CIS pixels
Each pixel of CIS contains an amplifier and A/D conversion circuit, and too many additional devices compress the surface area of the sensitive region of a single pixel, so that the sensitivity of CIS is low, CIS suppliers have been working hard to reduce the pixel spacing.
Reduced signal and noise, improved CIS performance
CIS imaging devices have high integration, the distance between photoelectric components and circuits is very close, and the optical, electrical and magnetic interference between each other is serious, and the noise has a great impact on the image quality.
02、 Power CIS - flying in the wind
Only by reducing the impact of disadvantages can CIS performance be maximized, and we need to find ways in packaging without affecting its function.
The upgrading of the packaging link is inseparable from two aspects, one is the material and the other is the process.
In terms of materials, traditional plates FR-4 and FE-3 are unable to meet the needs of CIS. Ceramic circuit board has excellent heat dissipation, high matching coefficient of thermal expansion, can be high-density assembly (line/pitch (L/S) resolution can reach 20μm) and other performance, obviously can meet the CIS heat dissipation, life growth, to achieve equipment integration, miniaturization and other performance requirements, not only the CIS advantages to the extreme, but also to ensure that its drawbacks can be minimized.
In terms of process, various metallization technologies include HTCC, LTCC, DBC, DPC and other process methods, but only DPC film technology is the use of magnetron sputtering method to firmly combine copper and ceramic substrate, so the ceramic circuit board has good metal crystallization performance, good flatness, line is not easy to fall off, and has reliable and stable performance. Thus, the combination strength between the chip and the substrate is effectively improved, which is conducive to the quality control of CIS.
In addition to the above advantages, the ceramic circuit board using the DPC film process can achieve three wikis, three-dimensional wiring, good corrosion resistance, keep the circuit at a constant temperature, etc., and help to consolidate and strengthen the CIS performance and characteristics.
At present, CIS is developing in the direction of high resolution, high sensitivity, integration and intelligence. There is no doubt that the CIS market will not stop here and will have a better development prospect.
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