FOLYSKY（WuHan） LTD.
hotline：
027-88111056
technical：
13387504731
FOLYSKY（WuHan） LTD.
As we all know, with the continuous development of artificial intelligence, Internet of Things, big data and other technologies, the manufacturing industry is facing a new round of intelligent upgrading, and digitalization, networking, and intelligence have become the core path to achieve "China's intelligent manufacturing".
The rise of artificial intelligence has given Chinese integrated circuits a golden opportunity. Some time ago, the birth of the first integrated circuit university in China's first chip university undoubtedly marks the rapid development of the chip industry.
Height integrated circuit
Ceramic circuit board - ideal packaging substrate
With the development of integrated circuits on the rise, the highly integrated circuit board has become an inevitable trend. Ceramic materials with high thermal conductivity, good insulation, large capacity and other unique advantages have gradually developed into a new generation of integrated circuits and power electronic modules of the ideal packaging substrate.
Common ceramic metallization techniques include: thin film method, thick film method, direct copper coating method and so on. The film method is suitable for most ceramic substrates, the metal crystallization performance is good, the flatness is good, the line is not easy to fall off, and the line position is more accurate, the line distance is smaller, and the reliability is stable.
01 Flat series - two-dimensional ceramic circuit board
We do the plane series of ceramic circuit board: alumina ceramic circuit board, aluminum nitride ceramic circuit board, ceramic copper-clad plate, glass circuit board.
Ceramic circuit boards have many characteristics, such as high thermal conductivity, high insulation, high line accuracy, high surface flatness, thermal expansion coefficient and chip matching, and occupy an important position in packaging.
02 3D Series - 3D ceramic circuit board
In the ceramic package, as the bearing substrate of the chip, it plays the role of mechanical support protection, electrical interconnection (insulation), heat conduction and heat dissipation.
The surface of the curved ceramic circuit board is metallized by magnetron sputtering to ensure that there will be no delamination and warping during the packaging process.
Ceramic circuit boards have better thermal and electrical properties, is an excellent material for power type packaging, suitable for multi-chip (MCM) and substrate direct bonding sheet (COB) package results, but also can be used as other high-power power semiconductor modules cooling circuit board.
In the future, R&F Tiansheng will continue to adhere to the enterprise purpose of "scientific and technological innovation to promote the development of the electronics industry", constantly improve and improve, and strive to promote the good development of integrated circuits in microminiaturization, low power consumption, intelligence and high reliability.
Strive to provide customers with the most professional, fastest, most intimate customized services, and strive to create an intelligent life for the society.
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