Base material type: 99.6% alumina ceramic

                                Base material thickness: 2.0mm

                                Conductive layer: copper, nickel, palladium, gold

                                Metal layer thickness: 70um+200 μ M

                                Surface treatment: nickel palladium

                                Metal single/double sided: double sided

                                Conducting hole: 0.3mm electroplated sealing hole filling