Thin film method is the main method for metal film deposition in 

microelectronics manufacturing, with direct plating copper being 

the most representative. Direct copper plating (DPC) mainly uses 

urface deposition processes such as evaporation and magnetron 

sputtering to metallize the surface of the substrate. Firstly, titanium

 is sputtered under vacuum conditions, followed by copper particles,

 finally thickened by electroplating. Then, the circuit is made using 

ordinary PCB technology, and finally, the thickness of the circuit is 

increased by electroplating/chemical plating deposition.

The DPC process is suitable for most ceramic substrates, with good 

crystallization performance and flatness of metals. The circuit is not

 easy to detach, and the circuit position is more accurate, the line 

spacing is smaller, and the reliability is stable.