Substrate type: aluminum nitride

Number of layers: double-sided

Thickness: 0.5mm

Size: 100X100MM

Board copper thickness: 0.070mm

Copper thickness inside the hole: 0.070mm, through hole electroplating and hole filling

Line width and distance: 0.2/0.12mm

Minimum aperture: 0.09mm

Surface treatment: nickel and palladium precipitation