Substrate type: aluminum nitride

Number of floors: double-sided+dam enclosure

Thickness: 0.5mm

Size: 54.5 * 109.2 π m

Plate copper thickness: double-sided bottom copper 0.07mmt front dam 0.4mmt front step 0.2mm

Copper thickness inside the hole: electroplated hole filling

Line width and distance: --/0.12mm

Minimum aperture: 0.09mm

Surface treatment: nickel and palladium precipitation