Substrate type: aluminum nitride

Number of floors: double-sided+dam enclosure

Thickness: 0.38mm

Size: 3X3MM (single)

Plate copper thickness: double-sided bottom copper 0.07mmt, front dam 0.5mt, front step 0.2 π m

Copper thickness inside the hole: electroplated hole filling

Line width and distance: 0.3/0.12mm

Minimum aperture: 0.09mm

Surface treatment: nickel and palladium precipitation