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FOLYSKY（WuHan） LTD.
After completing the packaging of electronic chips, a series of tests are also required, mainly to test their quality and reliability.
Quality inspection is to see if it can be used, whether it is easy to use, and whether it can achieve the expected function; Reliability refers to the detection of problems that are prone to malfunctions during product operation, as well as the length of product service life. Reliability has always been a problem that product development and innovation need to face, after all, only stable products will be needed by the market, and there is a possibility of large-scale production and profit.
A ceramic substrate is a good example. The use of special ceramics to produce ceramic substrates in China is still a relatively new concept. Compared with foreign ceramic substrate technology, domestic products have some shortcomings in the early stage. Before the product was upgraded, the market was not very clear. In some electronic fields that urgently needed high-performance support for ceramic substrates, manufacturers either hesitated or reluctantly chose imported products. Nowadays, Sliton's ceramic substrate technology has taken the lead in achieving breakthroughs and creating patented products, which are among the best in China. Compared to the previous stage, the produced ceramic substrates have not only been fully strengthened in hardness, but also greatly improved in overall performance, meeting the expectations of the public.
So today, let's take a look at the advantages of ceramic substrates through two reliability tests that packaging manufacturers typically conduct:
The first item is Temperature Cycling. In testing, the parameters that need to be recorded include hot chamber temperature, cold chamber temperature, number of cycles, and chip single chamber residence time. The main purpose of this test is to test the durability of semiconductor packaging during thermal expansion and contraction, which will reflect the thermal expansion coefficient of the substrate. Generally speaking, the closer the thermal expansion rate to silicon chips, the less likely they are to have poor contact and solder detachment. The thermal expansion coefficient of ceramic substrates is 4.3x10-6/° C at 20-400 ° C, which can be said to be very compatible with Si. Other organic material substrates, especially epoxy resin substrates, are prone to delamination.
Also, some testing involves placing the test package in harsh environments such as high temperature for testing, known as HTS (High temperature Storage) testing. HTS testing mainly aims to determine whether the conductivity of the substrate material is good in harsh environments. In addition, the high-temperature environment itself is also a major test for the substrate material. For ceramic substrates, as the metal layer does not contain organic matter, special ceramics are made at high temperatures. HTS testing is like the alchemy furnace used by Sun Wukong, discovering the 'golden eye' - demonstrating the superior conductivity and high-temperature resistance of ceramic circuit boards, which can operate well in harsh environments.
In the test, the ceramic substrate strongly demonstrated its advantages compared to other organic material substrates: strong thermal conductivity, better matching of thermal expansion coefficient, high temperature resistance, lower resistance and stability of the metal layer... In a word, it proves the current high stability of the ceramic substrate. In the development history of the packaging industry, early packaging manufacturers attached great importance to production capacity, and later went through a period of being king of product quality. However, after entering the 21st century, the focus of competition among manufacturers has been focused on 'equally high-quality but more reliable' products. High reliability has become an important indicator of modern packaging technology research and development. Domestic manufacturers with demand should be impressed and decisively adopt high-quality substrate materials, To promote technological upgrading and product progress.
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