FOLYSKY（WuHan） LTD.
hotline：
027-88111056
technical：
13387504731
FOLYSKY（WuHan） LTD.
As the demand for LED (light-emitting diode) lamps continues to grow, new cooling technologies are enabling manufacturers to produce LED leds with larger light outputs and longer life spans. Leds offer many advantages, including low power consumption, long service life (bulbs can last up to 40,000 hours or more), and are environmentally friendly (no mercury). As new manufacturing technologies reduce the production cost of leds and enhance their heat dissipation capabilities, the shortcomings of leds (such as higher prices than incandescent or fluorescent lamps) will gradually disappear.
According to information provided by the U.S. Department of Energy's Office of Energy Efficiency and Renewable Energy, heat dissipation is one of the most important factors in the successful design of LED systems. Leds can only convert 20% to 30% of the electrical energy into visible light, and the rest into heat, which must be imported from the LED chip to the circuit board and heat sink. The excess heat will reduce the light output of the LED and shorten its life. Therefore, the improvement of heat dissipation efficiency is very important to optimize the performance potential of leds.
Use a cooling substrate instead
Currently, LED substrates or modules for high power/high brightness applications are welded to a metal-based printed circuit board (MCPCB), enhanced heat dissipation printed circuit board, and then the substrate is glued to the heat sink. Although this configuration is widely used in the LED industry, it is not the best method of heat dissipation and can be costly to manufacture.
MCPCBS and enhanced heat dissipation printed circuit boards have good heat dissipation performance, but the design flexibility is limited, and if the heat dissipation efficiency needs to be improved, the cost can be high, because of the additional cost of heat dissipation hole processing and expensive thermal insulation materials. All in all, the cost of copper substrate is higher than that of MCPCB and enhanced heat dissipation printed circuit board substrate.
To replace the above substrates, LED manufacturers are testing the method of making circuits directly on the thick film ceramic substrate substrate, because this method can provide excellent thermal conductivity. Due to its advantages, the LED industry is interested in using ceramics, but it is very difficult to hit the road on the ceramic substrate. Now, advances in thick film technology have enabled the LED industry to reap the benefits of using thick film ceramic substrates.
The Material System for Ceramic Substrates (CSMS) developed by ceramic substrate supplier Sliton is a low-temperature sintering (below 600 ° C) insulation system that can be printed and sintered on ceramic substrates. The CSMS material system consists of a dielectric paste, a silver conductive paste, a glass protective layer and a resistive paste. These materials are suitable for 92, 94, 95, 96, 99 series ceramic substrates.
Reduce heat, extend service life
Sliton's ceramic substrate material system reduces thermal resistance by reducing the number of joints/layers in the LED kit. By using this single-formulation, versatile system, LED manufacturers are able to make design changes at low cost and selectively print insulation layers. Due to the ability to use a lower cost substrate, it is possible to enhance the conductivity and extend the life of the LED.
Keeping the LED kit at a low temperature is key to achieving the best LED function. Reducing the temperature of the LED by 10 degrees can more than double the life of the device and reduce the total cost, which makes the LED more attractive to consumers.
Follow us
customer service
