FOLYSKY（WuHan） LTD.
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FOLYSKY（WuHan） LTD.
The development and trend of high-power LED packaging technology continues to improve in the direction of low thermal resistance, high reliability, high luminosity, long life, easy processing, small size and low cost. Ceramic packaging has always occupied a place in the high-power LED market with its unique characteristics of high temperature resistance and non-deterioration.
In the process of promotion to the field of LED power device packaging, the inherent shortcomings of LTCC/HTCC thick film circuit ceramic substrate are clearly revealed, making this packaging form in the LED field such as a flash in the pan fast decline, around 2012 that quickly withdrew from the market, replaced by a flat type of DPC ceramic substrate. Its typical supplier is China's Sliton.
Flat type DPC ceramic substrate is a technology that combines thin film circuit and electroplating process. The wire is made by image transfer on thin film metallized ceramic plate, and then the vertical interconnection between high density double-sided wiring is formed by perforation electroplating technology.
Although the flat-type DPC ceramic substrate has been widely used in the LED field, the yellow light micro-film technology used in the film line can only be wired on the flat plate, and its process limitations make them unable to make three-dimensional sealed chambers on the ceramic substrate, unable to achieve three-dimensional airtight packaging of LED power devices, and meet special requirements such as high air tightness, high vacuum or inert gas filling.
In order to achieve airtight packaging, DPC ceramic substrate generally adopts injection molding to achieve sealant filling and molding, which has high technical requirements, complex process flow and expensive injection molding equipment, which also limits the wide application of thin film circuit ceramic substrate in the field of power devices.
In view of the application defects of the existing substrate in the field of power device packaging, Silitong has broken through the ceramic-metal 3D forming technology through dedicated research and development, and introduced the 3D forming DPC ceramic substrate with metal sealing cavity to meet the development needs of the existing power device packaging technology.
Slitong 3D formed DPC ceramic substrate, the line layer still retains the film line ceramic substrate unique high resolution, high flatness and high reliable vertical interconnection and other technical advantages, and on the surface of the ceramic substrate integrated molding to obtain a metal sealing cavity, forming a ceramic - metal 3D sealing structure.
This technology not only eliminates the defects such as low dimensional accuracy and rough circuit of thick film substrate such as LTCC/HTCC, but also makes up for the defects that the existing film substrate cannot produce 3D sealing cavity. Moreover, the substrate can be arbitrarily selected from different ceramic materials such as high-thermal aluminum nitride, high-strength silicon nitride and high-purity alumina according to the needs of packaging, with good process consistency and low cost. It provides a broader solution for the packaging of highly reliable, high-power and miniaturized LED power devices.
In the domestic market, the traditional white LED packaging technology is mainly used, and its packaging material contains organic materials, although the ceramic substrate is used as the chip support, but the transparent light material is still silica gel and epoxy resin. Such organic materials are the key to the life and reliability of UVLED, making the device unable to achieve airtight packaging, leading to great risks in the cold and hot cycle experiment of LED reliability.
The 3D molded DPC ceramic substrate from Sliton offers the best solution for the complete removal of organic packaging materials. The ceramic base plate and the metal dam are formed in one body to form a sealed cavity with no connection interface, high air tightness and good water resistance. The shape of the metal dam can be designed arbitrarily, and the top of the dam can be prepared with positioning steps to facilitate the accurate placement of glass lenses. According to the air tightness requirements of the device, the connection between the dam and the lens can be easily welded or bonded. 3D molded DPC ceramic substrate can be manufactured whole, with high process consistency, low cost, short manufacturing cycle, no mold development costs and other advantages, very suitable for large-scale automated production.
The LTCC/HTCC ceramic substrate currently launched in the market adopts thick film screen printing technology in its solid crystal area, and the line resolution and surface roughness cannot meet the requirements of chip flip eutectic. However, the 3D molded substrate launched by Slitone adopts thin film process in its line layer, which fully meets the process requirements of chip flip eutectic, and is equipped with glass cover metal sealing technology. Fully inorganic flip eutectic packaging is currently the most suitable substrate solution for UV-CLED packaging.
In addition, in view of its good sealing, thermal conductivity, heat resistance, insulation, high frequency characteristics and low thermal expansion coefficient and other advantages, the 3D formed DPC ceramic substrate launched by Sliton, It has been widely used in the packaging fields of SiC, GAN-based third-generation photoelectric and semiconductor power devices, optical fiber communication, 5G RF modules, high-power microwave devices, photovoltaic modules, MEMS sensors and so on, and has broad market prospects.
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