FOLYSKY（WuHan） LTD.
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FOLYSKY（WuHan） LTD.
The rapid development of the Internet of Things in recent years will strongly drive the transformation and upgrading of traditional industries. It leads the rapid development of emerging industries, thus causing the deep reform of social production and economic development. In the entire Internet of Things industry chain, MEMS sensors play an increasingly important role, playing its core role in the coming era of intelligent Internet of Things, bringing more intelligent and more sensitive perception to new technology products. But it will also have some difficulties, then the ceramic circuit board to make up for it.
We know that MEMS sensor is a kind of micro sensor manufactured by microelectronics and micromachining technology. Therefore, it has the characteristics of miniaturization, integration, intelligence, low cost and high performance. However, because it manufactures components such as microstructures, microsensors and microcontrollers on a chip or a miniature limited space, heat dissipation is a big problem when working. Therefore, ceramic circuit boards with higher thermal conductivity than traditional PCBS are good helpers.
MEMS devices in the micron or micro - and nano-scale parts, its high precision but very fragile, so the stress can not be too large. The expansion coefficient of ceramic and Si in the chip material in the ceramic circuit board is close to that in the package or temperature change, there will be no large stress. And MEMS devices generally work in a variety of strong vibration, acid and alkaline substances and other chemical substances or organic solvents and other application environments, so the packaging structure and packaging materials are required to adapt to a variety of complex working environments. The copper layer of the ceramic circuit board does not contain an oxide layer, and has the characteristics of corrosion resistance in the face of various complex environments, which improves the stability and reliability.
With the application of miniaturization and precision design in order to meet the emerging technology, the requirements for three-dimensional graphics rendering of its packaging substrate have increased. And different from the traditional integrated circuit (IC) package, the purpose of the traditional IC package is to provide physical support for the IC chip, protect it from environmental interference and damage, and achieve electrical interconnection with external signals, energy and ground. However, MEMS devices need to face the harsh and complex external environment, so its interaction with the external environment and its own structural complexity increase the difficulty of its packaging. Therefore, the traditional packaging substrate material is difficult to meet it, so the ceramic circuit board as a packaging material can reduce its packaging difficulty.
In the ceramic substrate manufacturing technology, the ceramic substrate manufactured by DPC technology can be designed into a three-dimensional chamber structure, which can meet the impact of MEMS devices to isolate some environments, and the three-dimensional circuit pattern design is also flexible. I believe that in the near future, such ceramic circuit boards that fit MEMS sensors will be able to bloom their glory in the new era!
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