FOLYSKY（WuHan） LTD.
hotline：
027-88111056
technical：
13387504731
FOLYSKY（WuHan） LTD.
Electronic packaging materials refer to the matrix materials used to carry electronic components and their mutual connections, and play a role in mechanical support, sealing environmental protection, signal transmission, heat dissipation and shielding. Including substrate, wiring, frame, interlayer medium, sealing material. The electronic packaging substrate material, as an electronic component, mainly provides mechanical load support, air tightness protection and promotes heat dissipation of electrical equipment for electronic components and their mutual connections.
The package substrate mainly plays an electrical transition role between the semiconductor chip and the conventional PCB (printed circuit board), and provides protection, support and heat dissipation for the chip. The main materials include ceramics, epoxy glass, diamond, metal, metal matrix composites.
As part of electronic packaging materials, electronic packaging substrate materials should meet the following performance requirements:
1. Good thermal stability to ensure that electronic components are not damaged by heat
2. Thermal expansion coefficient matching the chip
3. Good high-frequency characteristics to meet the needs of high-speed conduction
In addition, the electronic packaging substrate should also have the characteristics of high mechanical properties, good electrical insulation properties, chemical stability and easy processing. Of course, in practical applications and large-scale industrial production, the price factor can not be ignored.
Classification of ceramic packaging materials
At present, the high thermal conductivity ceramic substrate materials that have been used in actual production and development applications mainly include Al2O3, AlN, Si3N4 and so on.
(1) Al2O3 ceramic substrate
Alumina ceramic is currently the most mature ceramic substrate material, the advantages are low price, heat shock resistance and electrical insulation is better, the preparation and processing technology is mature, so widely used in the electronics industry, has become an indispensable material in the electronics industry.
(2) AlN ceramic substrate
Aluminum nitride ceramic substrate has excellent electrical and thermal properties, compared with alumina has a higher thermal conductivity (generally 170 ~ 230 w/mk), suitable for high-power, high-lead and large-size chips, and aluminum nitride material is hard, can work under harsh environmental conditions, so it can meet the application of different package substrates.
(3) Si3N4 ceramic substrate
Silicon nitride ceramic substrate has high theoretical thermal conductivity, good chemical stability, non-toxicity, high bending strength and fracture toughness. The maximum thermal conductivity can reach 177W·m-1·K-1, and the mechanical properties are also relatively excellent (the bending strength reaches 460MPa, the fracture toughness reaches 11.2MPa·m1/2), and the thermal expansion coefficient is well matched with Si, SiC and GaAs materials. It is considered as a potential thermal packaging material for high speed circuits and high power devices.
The rapid development of science and technology has led to the upgrading of a series of electronic products, and electronic systems and equipment have also developed in the direction of integration, miniaturization, efficiency and reliability. The improvement of the integration of electronic systems will also lead to an increase in product density, and then the heat of the entire electronic components and systems will increase during formal operation, ceramic packaging substrate as a new green package with high thermal conductivity and good comprehensive performance, has become an important direction for the sustainable development of electronic packaging materials in the future. Slitong will cooperate with customer needs, cater to market orientation, and provide more excellent products and more intimate services.
Follow us
customer service
