FOLYSKY（WuHan） LTD.
hotline：
027-88111056
technical：
13387504731
FOLYSKY（WuHan） LTD.
The ceramic packaging substrate is a key link to connect the internal and external heat dissipation channels, which can provide electrical connection, protection, support, heat dissipation, assembly and other functions for the chip to achieve multi-pin, reduce the size of the package product, improve the electrical performance and heat dissipation, ultra-high density or the purpose of multi-chip modularization.
With the continuous upgrading of science and technology in recent years, the input power of the chip is getting higher and higher. For high-power products, the packaging substrate requires high electrical insulation, high thermal conductivity, and the thermal expansion coefficient matching the chip. Previously packaged on a metal PCB board, it is still necessary to introduce an insulating layer to achieve thermoelectric separation. Due to the poor thermal conductivity of the insulation layer, although the heat is not concentrated on the chip at this time, it is concentrated near the insulation layer under the chip, once the higher power is done, the problem of heat dissipation will emerge. This clearly does not match the direction of the market.
The DPC ceramic substrate can solve this problem, because the ceramic itself is an insulator, the heat dissipation performance is good, the DPC ceramic circuit board can be directly fixed on the chip on the ceramic, there is no need to do the insulation layer on the ceramic.
DPC ceramic substrates also have various advantages
Low communication loss - the dielectric constant of the ceramic material itself makes the signal loss less.
High thermal conductivity - the thermal conductivity of alumina ceramics is 15 ~ 35 w/mk, the thermal conductivity of aluminum nitride ceramics is 170 ~ 230 w/mk, the heat on the chip is directly transmitted to the ceramic sheet above, without the insulation layer, you can achieve relatively better heat dissipation.
More matching coefficient of thermal expansion - the material of the chip is generally Si (silicon) GaAS (gallium arsenide), the thermal expansion coefficient of the ceramic and the chip is close, and it will not cause too much deformation when the temperature difference changes, leading to problems such as line derwelding and internal stress.
High bonding force - The metal layer of Silitong ceramic circuit board products has a high bonding strength with the ceramic substrate, and the maximum can reach 45MPa (greater than the strength of the 1mm thick ceramic sheet itself).
Pure copper through hole - Silitong Ceramic DPC process supports PTH (electroplated through hole) /Vias (through hole).
High operating temperature - ceramics can withstand fluctuating high and low temperature cycles, and can even operate normally at high temperatures of 600 degrees.
High electrical insulation - Ceramic materials are themselves insulating materials that can withstand high breakdown voltages.
Customized services - Slitong can provide customized services according to customer needs, and carry out mass production according to the product design drawings and requirements given by users. Users can have more choices, more human.
DPC substrate process, the use of thin film manufacturing technology - vacuum coating method on the ceramic substrate sputtering combined with copper metal composite layer, so that copper and ceramic substrate has a strong bonding force, and then yellow light microshadow photoresistance to re-exposure, development, etching, film removal process to complete the line production, and finally electroplating/electroless deposition method to increase the thickness of the line. After the photoresistance is removed, the metallization line is completed.
DPC ceramic substrates are more in line with the future development direction of high density, high precision and high reliability, and it is a more viable option for manufacturers. Slitong will continue to strive to create high-quality products, provide customers with more satisfactory products and services, and achieve win-win cooperation with merchants.
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