Sapphire ceramic circuit board

Substrate type: sapphire Base material thickness: 0.38mm Conductive layer: copper, nickel, gold Metal layer thickness: 18 μ M Surface treatment: deposited nickel gold Surface roughness of substrate: 0.02-0.08um Th

Silicon carbide ceramic substrate

Base material type: silicon carbide ceramic Base material thickness: 0.5mm Conductive layer: copper, nickel, gold Metal copper thickness: 65 μ M Line width: 0.3mm Through hole: None Surface treatment: deposited ni

Aluminum nitride ceramic circuit board

Base material type: aluminum nitride ceramic Thermal conductivity: 200W/(m · K) Base material thickness: 1.0mm Metal copper thickness: 30 μ M Conductive layer: copper, silver Line spacing: 4.0mm Through hole: None

Ceramic cutting

The detailed product introduction is as follows 1. Materials ① . 96% alumina ceramic ②. 99% aluminum nitride ceramic. Sapphire ④. High borosilicate glass

Ceramic metallization

Base material type: 96% Al2O3; 96% AlN

Ceramic drilling

1. Material: ①. 96% alumina ceramic ②. 99% aluminum nitride ceramic ③. Sapphire ④. High borosilicate glass 2 conductor process: DPC (direct copper plating) 0.1-10oz; LAM (Laser Attached Copper) 0.1-10oz 3. Performance: Copper bonding force (N/cm2):