Substrate type: sapphire

Base material thickness: 0.38mm

Conductive layer: copper, nickel, gold

Metal layer thickness: 18 μ M

Surface treatment: deposited nickel gold

Surface roughness of substrate: 0.02-0.08um

Thermal conductivity: ≥ 26W/(m · K)

Dielectric constant: 9.6-10.2MHz

Bending strength: ≥ 550MPa