Ceramic PCB water jet cutting

Special type: water jet cutting (with a blue film on the back) Base material thickness: 0.2mm Conductive layer: copper, nickel, palladium, gold Surface treatment: nickel gold Metal single/double sided: double sided Minim

Aluminum nitride ceramic cooling sheet copper clad plate

Base material type: aluminum nitride ceramic Base material thickness: 0.15mm Metal layer thickness: 18 μ M Surface treatment: nickel and palladium precipitation Cutting method: water jet cutting, with a blue film on the back

Sapphire ceramic circuit board

Substrate type: sapphire Base material thickness: 0.38mm Conductive layer: copper, nickel, gold Metal layer thickness: 18 μ M Surface treatment: deposited nickel gold Surface roughness of substrate: 0.02-0.08um Th

Silicon carbide ceramic substrate

Base material type: silicon carbide ceramic Base material thickness: 0.5mm Conductive layer: copper, nickel, gold Metal copper thickness: 65 μ M Line width: 0.3mm Through hole: None Surface treatment: deposited ni

Silicon carbide ceramic packaging substrate

Base material type: silicon carbide ceramic Base material thickness: 0.38mm Conductive layer: copper, silver Metal copper thickness: 5 μ M Line width and distance: 0.12/0.5mm Through hole: filling hole Surface tre

Ceramic metallization

Base material type: 96% Al2O3; 96% AlN