陶瓷片成型后需要通过陶瓷金属化工艺使陶瓷表面沉积一层致密结合力良好的金属层，再通过普通FR-4线路板工艺流程制作电路板。这一整套工艺流程的核心点在于陶瓷的金属化，目前市面上主流的陶瓷金属化工艺分为以下几种，各种工艺的优缺点如下：

斯利通DPC陶瓷电路板又称直接镀铜陶瓷电路板，主要用蒸发、磁控溅射等面沉积工艺进行基板表面金属化，先是在真空条件下溅射钛然后再溅射铜颗粒，再进行电镀增厚，在薄膜金属化的陶瓷板上采用影像转移方式制作线路，再采用电镀封孔技术形成高密度双面布线间的陶瓷电路板。

因为陶瓷基板优良的电热化学特性，其在电子封装领域占据着越来越重要的角色，被广泛应用在高功率IGBT、大功率电子模组、微波加热电子元器件、微型制冷片、毫米波激光雷达、传感器等高科技技术型行业。相信随着未来科技的发展，陶瓷电路板在电子信息化产业的前进道路上更能一展宏图！

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