FOLYSKY（WuHan） LTD.
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FOLYSKY（WuHan） LTD.
As we all know, metal substrate is metal layer (aluminum, aluminum alloy, copper, iron, molybdenum, and other metal sheets), insulating medium layer (epoxy resin, etc.) and copper foil (electrolytic copper foil, calendered copper foil, etc.) trinity composite made of metal base copper clad plate. Although the PCB printed from this substrate has a large number of applications in the electronics industry, the trend is no longer obvious. The ceramic substrate is a circuit board born for the trend of The Times. So what are the advantages and disadvantages of these two types of substrates?
First of all, from the point of view of its copper coating process, two degrees of association should be considered in the degree of association, which leads to the reduction of the probability of its excellent rate. At the same time, the thermal conductivity of the common metal substrate is 1 ~ 2W/mk, although it can cope with the heat dissipation of some small power devices. However, the current trend is that intelligent and micro-integration are becoming more and more popular, and more and more high-power devices are being used, which gradually increases the requirements for packaging substrates. The thermal conductivity of the alumina substrate in the ceramic substrate is 15 ~ 35W/m.k, which is more than ten times that of the general metal substrate, and the thermal conductivity of the aluminum nitride substrate can reach up to 170 ~ 230W/m.k.
And the metal copper-clad plate also needs to have an insulating dielectric layer, this dielectric layer is generally composed of a variety of epoxy resin materials, this organic material and ceramic materials compared with high insulation, or lower dielectric constant, ceramic is more excellent. When the current runs in the painted line, the ceramic material has lower frequency loss. And in the high frequency circuit design, so that it has high frequency, while the insulation can withstand breakdown voltage of up to 20KV/mm, in the kind of need to withstand the ultra-high voltage of more than 6500W IGBT module can be a good application. Among them, the thermal expansion coefficient of ceramic substrate and silicon chip is closer, which can not catch up with the metal clad copper plate in solving the problems of power element stress and preventing welding. In environmental protection, ceramics are inorganic materials, metal substrates are mostly organic materials, in waste recycling or manufacturing, organic materials are very polluting to the environment.
In summary, metal circuit boards can continue to glow in the low-power market due to cost-effective. And with so many excellent performance of the ceramic circuit board will march forward in the tide of The Times!
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