FOLYSKY（WuHan） LTD.
hotline：
027-88111056
technical：
13387504731
FOLYSKY（WuHan） LTD.
As we all know, in today's society, IGBT power modules are becoming more and more important, and have a wide range of applications in household appliances, rail transit, power engineering, renewable energy and smart grid. And IGBT industry is involved in national economic security, national defense security and other strategic industries, you can imagine how important it is.
So what does this important module look like? It's actually just a small square as big as a fingernail, but despite its small size, it has a lot of energy. Without this small device, trams, subways, electric trains (high-speed trains, high-speed rail), even airplanes, ships, and any equipment driven by variable frequency motors would all have to collapse. It uses various driver protection circuits such as IC drivers, and then uses new packaging technology to finally achieve high-performance IGBT chips. Among them, it also enables the natural evolution of high current, high voltage applications and fast end devices with vertical power to achieve a low voltage drop, thus converting to a low VCE(sat), as well as the IGBT structure, which can support higher current densities.
Therefore, the amount of energy that an IGBT chip can process is different from those that process information or store data. Its main role is to control and transmit electrical energy, the IGBT composed of chips the size of fingernail can handle the ultra-high voltage of more than 6500W, so it can achieve 100,000 current switching actions in a short time of 1 second, so that the high-speed rail can travel quickly.
And the IGBT substrate not only needs to withstand ultra-high voltage, but also bear the heat emitted by 100 electric furnaces. The groove grid structure expands the component placement area, meets the needs of more intelligent and miniaturized, but increases the heat dissipation burden, so the traditional substrate can not bear it. At this time, the ceramic copper-clad plate is an essential part of it.
The ceramic copy-coated substrate is composed of ceramic substrate, bonding bonding layer and conductive layer, which refers to the special process method of copper foil directly bonding to the surface of alumina or aluminum nitride ceramic substrate at high temperature. This made alumina and aluminum nitride ceramic substrate, because the ceramic material has ultra-high insulation, breakdown resistance voltage can be up to 20KV/mm. At the same time, the thermal conductivity of alumina substrate is 15 ~ 35W/m.k, and the thermal conductivity of aluminum nitride substrate is 170 ~ 230W/m.k, which is many times higher than the traditional thermal conductivity of aluminum substrate 1 ~ 2W/mk. Therefore, IGBT can flexibly choose the corresponding ceramic copper-clad plate according to the size of its own power, so as to achieve the purpose of heat dissipation. In addition, the resistivity of alumina and aluminum nitride ceramic substrate is less than 2.5× 10-6ω.cm, so that the high voltage flow will be smaller heat.
Therefore, in the future application fields of more IGBT modules, the emergence of ceramic coppered plates will be accompanied by a more intelligent experience for the majority of users.
Follow us
customer service
