FOLYSKY（WuHan） LTD.
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FOLYSKY（WuHan） LTD.
In ceramic substrate, it is well known that thin film and thick film. The main difference is metallization technology, thin film ceramic substrate is commonly made of DPC technology; The thick film ceramic substrate is mostly made of screen printing technology, and then the conductive paste is directly coated on the ceramic substrate, and the metal layer is firmly attached to the ceramic substrate through high temperature sintering. These two methods have their own characteristics, but the DPC film method has a low process cost (below 300 ° C), and is very suitable for electronic device packaging with high circuit accuracy requirements. This time, we mainly talk about the application of thin film ceramic substrate in the field of electronic communication.
When it comes to the communication industry, many people are familiar with it, whether it is a smart phone or mobile network, it is closely related to People's Daily life. The information source, channel, and home in the communication system are not many people know in detail, and the next step will be to explain in detail what role the thin film ceramic substrate plays in it.
Generally speaking, mobile phones and computers are both sources of information, but also the home. They use wireless or wired means to propagate electromagnetic wave signals in the air or optical fiber and finally be accepted by the receiving device. In the process of wireless transmission, it involves the weakening of the signal, which is why the mobile phone is full in a wide place, and the signal is poor in a room or a building. And this requires base stations, similar to signal transfer stations, to keep the signal alive at all times. Whether it is a base station or a mobile phone, the chip is needed to maintain the reception and transmission of signals.
With the vigorous construction of 5G, the future "no signal area" can be said to be zero, and the transmission frequency of 5G is more than one hundred times higher than 4G. Then in the future communication system, the importance of the chip will not be questioned. It should ensure that the electromagnetic wave signal can not be distorted in the process of converting into an electrical signal at a high frequency, and at the same time, such a high frequency electrical signal conversion will dissipate heat, and it is necessary to avoid overheating and damage to the component.
Thin film ceramic substrate can solve this problem. The thin film ceramic substrate consists of thin film alumina ceramic substrate and aluminum nitride ceramic substrate. They are all metallized with DPC technology, which can meet the requirements of miniaturization of mobile phone chips or base station chips, and the circuit accuracy is more detailed to meet the basic requirements of electrical signal transmission. At the same time, the dielectric constant is small, the high-frequency electrical signal loss is small, and the signal distortion is avoided. The thermal conductivity of thin film alumina and thin film aluminum nitride ceramic substrates is 15 ~ 35W/m.k and 170 ~ 230W/m.k, respectively. The base station can be divided into macro base station and micro base station, that is, the radiation range is large or small. Therefore, the macro base station with more signal processing generates more heat, so the thin film AlN ceramic base can be selected. The microbase station can be thin film Al2O3 ceramic base. In terms of mobile phones, whether it is the wireless network card that transmits and receives the signal, or its own mobile phone battery life and system chip, or 3D face recognition sensor, the most suitable or aluminum nitride ceramic base, which can ensure the high intensity heat dissipation of the mobile phone under more functions.
In the near future, when the communication market is getting larger and larger due to the construction of 5G, the thin film ceramic base will always follow, giving the greatest support to the communication market!
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