FOLYSKY（WuHan） LTD.
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FOLYSKY（WuHan） LTD.
Direct copper-clad substrates are suitable for high power applications (high current/high voltage) where excellent heat dissipation performance is often required. The main challenge is how to balance the miniaturization of chips with increasing power. Sliton's new DPC+ offers 15 solutions to ensure maximum flexibility in the production of power electronics modules.
The DPC process uses a silicon nitride substrate as an insulating layer, and the copper connection wire ensures excellent electrical conductivity at high temperatures. In order to ensure the best performance and highest reliability, the module must have heat dissipation components with good heat dissipation performance and ultra-high endurance to cope with thermal cycles and power cycles.
Sliton's high quality silicon nitride substrates offer a satisfactory performance/cost-benefit ratio. The thick copper foil ensures excellent electrical and thermal conductivity and provides a good basis for welding and bonding processes. In addition, Sliton can provide DPC+ with a complete portfolio of features and services that improve the functionality of the substrate, streamline processes, increase productivity and support the product development cycle. Choose the solution that best suits you from 15 solutions to maximize the performance of your product.
We ensure a perfect match between the substrate, its functional surface, chip attachment and the materials used in assembly and packaging technologies. Experts help you with long-term support during the development phase, helping to save time and costs.
Sliton's DPC silicon nitride ceramic substrates offer a satisfactory performance/cost-benefit ratio. The thick copper foil ensures excellent electrical and thermal conductivity and provides a good basis for welding and bonding processes.
The benefits of DPC:
1. Reduce the ink flow ejection speed to ensure more stable and higher level of product quality;
2. Metal or ceramic particles can reduce pollution;
3. Ensures fast delivery of DCB substrates with a new layout and standard material combination.
Benefits of DPC+ :
1. Solutions can be tailored to specific needs
2. Pre-testable solutions
3. We can meet your requirements for optimizing surface treatment processes or processing parameters for welding, sintering, bonded wire and bonded strips, whether in standard form or in the form of co-development.
Benefits of working with Sliton:
1. It can be adjusted according to your needs to provide a solution that is perfectly suited to your application
2. We can rely on exclusive technology to ensure that products enter the market faster
3. Sliton Application Center can test all improved products
4. Outstanding innovation ability
We recommend that DPC substrates be used in power electronics modules with MOSFET or IGBT semiconductor components and in diodes widely used in the industrial sector.
DPC has been widely used in several other market segments, such as medical technology (MRT and CRT), aerospace, radar systems, and heavy construction machinery. Looking ahead, DPC technology is also expected to play a role in industries such as agricultural vehicles and aircraft.
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